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        电子半导体设备
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产品信息

ODF System
V-Series

This system is used for bonding two substrates in a liquid crystal panel manufacturing process after applying sealant and liquid crystal.
This can also be offered in the form of a liquid crystal drop filling (ODF) line, including the transfer system.
・Pressure is adjustable for various bonding conditions.
・Long-life ceramic made electrostatic chuck realizes high retentivity and high precision.
・Various panel layout and contamination free process are obtained by adopting the method of untouching panel surface.
・Simple chamber with minimized number of driven parts for reducing the risk of contamination.
・Design of system structure with high rigidity realizes high precision alignment.

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